這兩家供應商將為空間陣列型元器件開發新型的焊膏材料. Air-Vac Engineering, pioneers in electronics rework equipment and processes, has teamed with Heraeus Materials Technology, providers of the world leading dippable solder pastes to create a new class of products that are optimized specifically for rework of BGAs and other area array devices. Dippable solder pastes combine low viscosity fluxes with very fine solder powders to help them form thin, uniform films on objects like BGA balls that are dipped in them. Fine powders with particle sizes of 25?m and smaller were once considered very difficult to reflow, but advances in powder manufacturing technology have enabled a new generation of process-friendly solder pastes. Originally developed for BGA ball attachment and then popularized in circuit assembly for Package-on-Package (PoP) applications, dippable pastes are now being used in rework operations. Traditionally, the rework process for BGAs and other area array devices includes manually stenciling solder paste onto the PWB or the device. The manual stencil printing process is not very consistent and is often impeded by neighboring components on the PWB and stencil flatness issues. Because dipping the BGAs in the paste provides more consistent solder volumes, removes the concerns of restricted access, and eliminates the cost of custom stencils for each device, its popularity in rework is rapidly growing. Development is currently underway at Heraeus Conshohocken, Pennsylvania RD center using Air-Vac Engineering's premier ONYX-29 rework system. Working together, the two companies will optimize current dippable paste formulations specifically for the rework process. The new product is scheduled for beta testing later this year.
