SMTA日前宣布將在8月17－21日在佛羅里達州奧蘭多的迪士尼科羅納多溫泉度假和會議中心舉行的2008年國際會議上召開無鉛焊接技術研討會.做為已經連續舉辦8屆的無鉛研討會,將有很多最先進的無鉛技術和進展在此向業界公布. Organized by Dr. Paul T. Vianco of Sandia National Labs, the Lead-Free Soldering Technology Symposium will begin with a full session describing the latest consortium activities by the iNEMI group. Of particular interest will be a discussion of methodologies to evaluate the many new alloy compositions for different product applications. Sessions two and three are devoted to the very popular topic of case-studies. Six papers will describe the actual experiences of companies currently at the forefront of implementing a Pb-free solder solution for consumer and high-reliability products. Session four provides attendees with state-of-the-art information pertaining to Pb-free interconnection reliability. Specific course topics will range from the latest test data on the thermal cycling and shock testing of various alloy compositions and package designs, to forwards and backwards compatibility issues that remain as a significant concern for companies making high-reliability products. Attendees will find all of these presentations to be timely and extremely informative. For more information, contact Melissa Serres Marx, 952-920-7682, melissa@smta.org.
