IPC?Association Connecting Electronics Industriesreg; and the China Printed Circuits Association (CPCA) announce the third annual Global Board Technology Symposium, ldquo;Working Together to Advance Industry Capability, October 13-14, 2006, in Shenzhen, China. The Symposium is open to industry PCB fabricators, assemblers (EMS) and industry equipment and material suppliers; original equipment manufacturers (OEMs); and original design manufacturers (ODMs) that supply products for the desktop, mobile, handheld, server, and wireless markets.Representatives from companies on IPCrsquo;s OEM Workgroup Committee (i.e. Intel, IBM, HP, Dell and TI) will present their companiesrsquo; future needs for PCB technology development and expanded assembly and test manufacturing. The intent is to share industry survey and test vehicle results to help align and advance PCB fabrication industry capabilities with OEM and ODM future product technology requirements. Additionally, the goal is to provide an open forum and stimulate discussion on technology trends, process and material challenges, and product roadmaps based on technology drivers and fabrication capabilities. ??OEMs, ODMs, and assembly and test companies will gain significant insight from the OEM workgroup explanations of how they use manufacturing surveys in combination with test vehicles (e.g. PCQRsup2;test program) to understand volume support available and to assess cost/price implications for various technology offerings. ?PCB fabricators will benefit from understanding the future technology needs of their current and future customers, as well as learning how the PCQRsup2; database can help them become more competitive, globally.To register or access more information on the Symposium, visit http://www.ipc.org/events.
