您現在所在位置：首頁 > 技術前沿
在線研討會――PoP組件的互聯耐久性
來源: fbe-china.com作者: EM Asia China時間：2019-11-20 13:32:24點擊：7948
December 7, 2010, 11:00am US EST $300 for non-consortium members. Free for consortium members On December 7, Dr. Michael Osterman will present an intriguing web seminar on Interconnect Durability of Package on Package Assemblies. In this one-hour seminar, Dr. Osterman will discuss Package on Package (PoP) methodologies, an emerging trend in packaging technology, and present an assessment of solder interconnect reliability in pre-stacking or in-line stacking and reflow-produced PoP assemblies. Seminar participants will learn how this developing methodology will be useful in multiple applications, from mobile to industrial and beyond.
> 相關閱讀：
> 評論留言：
