先進焊接材料供應商Kester日前宣布，將參展APEX 2008，并將參與期間的系列技術交流活動。Kester表示，除了在展位上展出各種先進的焊接材料和工具，高級市場開發工程師Peter Biocca還將參與4月2日舉辦的一次研討會，發布Kester在無鉛焊料使用中的技術成果。 Kesters Peter Biocca, Senior Market Development Engineer, will moderate Session S15 in the Backward Compatibility: Where Leaded and Lead-Free Collide tract of the technical conference from 9-10 a.m. on Wednesday, April 2, 2008. Although RoHS mandates that most leaded products migrate to lead-free processes, the legislation also specifies that certain classes of products are exempt. Even with exempt status, leaded assembly operations still have to deal with the lead-free reality of a vastly changed supply chain. What are the reliability and assembly pitfalls of manufacturing leaded products in a world that is rapidly moving to lead-free? This session will provide attendees with the latest reliability and assembly studies where leaded and lead-free collide. Peter also will moderate Session S25 in the Cleaning tract of the technical conference program from 1:30-3:30 p.m. on Wednesday, April 2, 2008. Cleaning remains a vital process in both fabrication and assembly. New material technologies, higher temperatures and denser assemblies all pose challenges to cleaning in todays environment. This session will discuss the newest materials and processes developed to meet those challenges. The technical conference held during APEX is known worldwide as one of the finest and most selective in the world. Key industry players will present new research and innovations in the areas of board design and manufacture, and electronics assembly. Additionally, there will be sessions that focus on manufacturing software, backwards compatibility and 3-D packaging as well as the conferences annual focus on key areas such as soldering, assembly processes, advanced packaging, materials and reliability. Additionally, David Scheiner will host the Solder Alloy Task Group meeting on Monday, March 31, 2008 from 1:30-3:30 p.m. This task group is gathering new information for amendments to J-STD-006B, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications. As always, Kesters global lead-free team of technical engineers will be present to answer all lead-free questions that companies may have about lead-free assembly. Be sure to stop by booth 1660 for more information. For more information on Kesters participation at APEX 2008, or Kesters full line of products and services including SE-CURE and InnovaBond products, contact Kester by phone at (+1) 847-297-1600 or 800-2-KESTER (53-7837), by fax at (+1) 847- 699-5548, or by e-mail at customerservice@kester.com. Kesters Web site may be found at www.kester.com.
