食品機械

12月3日,IPC/JEDEC無鉛電子國際研討會?陶夠嵩詰每巳斯州首府奧斯汀的德斯基酒店舉行,焊料供應商NiHon Superior參與了此次會議. Nihon Superiorpresentation will take place on December 4, 2007 at 10:45 a.m. The paper, Impact Strength of Lead-Free BGA Spheres, will be presented by Keith Sweatman. Additionally, Nihon Superior will have a tabletop exhibition. A company representative will be available to discuss the companyproducts and technologies. With the RoHS directive in place, the demand for advice and solutions is increasing dramatically. The IPC and JEDEC are holding this international lead-free conference to give the electronics industry answers to the challenges of implementing lead-free processes.