日前,Zestron宣布對于錯過了日前舉行的SMYA國際會議上推出的最新研究成果《低高度元件清洗的新定義》業界認識提供PDF版本的論文資料. The associated increase in the complexity of components in the electronics industry results in a continuous decrease in stand off spacing between the components and the substrates surface. At the same time, the requirements for the product reliability and life expectation are continuously increasing, especially in the case of RF Technology. This in turn makes cleaning mandatory and the question arises as to which cleaning process can provide the required cleanliness levels under narrow capillary spaces. Furthermore, the contacts that are present under BGAs, micro-BGAs or CSPs pose additional mechanical barriers. As a result, the capillary penetration of the cleaning and rinsing agent is hampered. A suitable cleaning process should not only allow the cleaning media ample access to capillary spaces, but it also has to remove contamination and discourage re-contamination. New innovative approaches are now being introduced to further address this increase in cleaning demand. These include innovations on the mechanical as well as on the chemical side. Specific cleaning products have been developed to support lowest cleaning process parameters (i.e. temperature, concentration) but at the same token address overall costs per cleaned part. To receive a PDF version of the technical paper A New Definition of Low Stand Off Cleaning, please contact ZESTRON via email infoUSA@zestron.com or phone 703-393-9880.
