Every company in the highly competitive electronics interconnect industry ― from original equipment manufacturers (OEMs) to PCB suppliers ― is working to optimize its products and processes and find the edge on the competition. IPC ― Association Connecting Electronics has announced a one-of-a-kind conference that encourages them to start at the very beginning ― the design. The IPC Global Design Conference: Building Better Today for Tomorrow, will be held August 15?16, 2007, at Delta Toronto East in Scarborough, Ontario, Canada. Lets face it, the design of the printed circuit board is the foundation for all the other processes, affirms Jean Hebeisen, director of the IPC Designers Council and professional development. The design affects the end product, and ultimately the bottom line. It is amazing how often the training and continuing education of the designer is overlooked CEO of FTG Circuits, Brad Bourne, will kick off the two-day event with a keynote address, Meeting the Manufacturers Needs Industry experts from companies such as Celestica, Honeywell, Electrochemicals and Cisco Systems will present on a variety of crucial topics for todays designers, including metal foils for high-speed signals, optimum transmission line parameters, metric pitch BGA and micro BGA, flexible circuit design, lead free, the IDF process and advanced technologies ― high-density interconnects (HDI) and embedded passives. For designers with an eye on manufacturability, a DfM workshop will be held August 1314. In addition, designers looking to achieve the ultimate in recognition, the designers certification and advanced certification, certification workshops and exams will be held August 16?18. Special pricing is available to individuals registering for more than one event. For more information on the conference or workshops, visit www.ipc.org/designconf or call Tina Nerad at +1-847-597-2826.
