SMTA China宣布邀請業界人士參與其在8月21～23舉辦的SMTA China 南中國研討會。這次研討會將于NEPCON South China同時舉行，內容涉及業界關注的電子組裝、先進封裝和無鉛可靠性問題。 SMTA China is calling for technical papers as well as full- and half-day short courses. The abstract, author biography and PowerPoint presentation must be submitted in both English and Chinese, and will be included in the conference proceedings. All presentations must be made in Chinese. Topics of interest include 01005 assembly, 3-D SiP (System in Package), PoP (Package on Package), Lead-free Reliability, Component Supply Integrity, Legal Responsibility of Non-RoHS Parts/Products Entering Europe, Materials and Process Characterization, and Flex Circuit Assembly. The Technology Workshop will feature full- and half-day courses on 27 August; the Technology Conference will offer 30-minute technical papers on 28 August; and the Vendor Day Conference will feature 20-minute product technical papers from 28-31 August. If you or your company has pertinent information to share and you are looking for an opportunity to address an audience in China, contact Peggy Chen, executive administrator of SMTA China, at +86-21-5609-3010 or e-mail a short abstract to peggy@smta.org. Please include name, job title, company affiliation and all pertinent contact information. The deadline is 30 May 2007.
