BANNOCKBURN,Ill.,USA,April1,2011―IPC―AssociationConnectingElectronicsIndustriesreg;?invitesresearchers,academics,technicalexpertsandindustryleaderstosubmitabstractsfortheIPCConferenceonReliability:AssemblyProcessforaReliableProduct,November1?2,2011inIrvine,Calif.Focusedonreliabilityissuesarisingattheassemblylevel,theconferencewillhighlightnewdevelopmentsinmaterials,processandtest. Expertpresentationsaresoughtontopics,includingcomponentselectionandstorage,componentmoistureissues,waveprocess,mitigatinglead-freeissues,reflowtemperatures,testvehicles,alloycharacterization,validatingresults,x-rayinspection,testmethods/defectdetection,flipchipassemblyprocess,ballgridarrayissues,bottomterminationcomponent/leadlesscomponentissues,electrostaticdischargeandboardstorage. Anabstractofnomorethan300wordsmustbesubmittedbyApril21,2011,toSusanFilz,IPCdirectorofindustryprograms,atSusanFilz@ipc.org.?Presentationsmaybebasedonpapers.Presentationsshouldbenoncommercialandemphasizenewtechnologies,discusstrendsofinterest,provideinsighttobestpracticesordescribesignificantresultsfromtestsorexperiments.Formoreinformationaboutthecallforpresentations,visitwww.ipc.org/reliability-cfp?orcontactSusanFilzat+1847597-2884orSusanFilz@ipc.org. AboutIPCIPC(www.IPC.org)isaglobaltradeassociationbasedinBannockburn,Ill.,dedicatedtothecompetitiveexcellenceandfinancialsuccessofits2,800membercompanieswhichrepresentallfacetsoftheelectronicsindustry,includingdesign,printedboardmanufacturing,electronicsassemblyandtest.Asamember-drivenorganizationandleadingsourceforindustrystandards,training,marketresearchandpublicpolicyadvocacy,IPCsupportsprogramstomeettheneedsofanestimated$1.85trillionglobalelectronicsindustry.IPCmaintainsadditionalofficesinTaos,N.M.;Arlington,Va.;GardenGrove,Calif.;Stockholm,Sweden;Moscow,Russia;Bangalore,India;andShanghai,ShenzhenandBeijing,China.
