April 12, 2011 11:00am US Eastern Time CALCE Webinar Event Non-Member Registration Form $300 for non-consortium members. Free for consortium members EPSC Member Registration Webinar URL Password Contact: Michael Osterman (osterman@umd.eduAbstract Thermal management of high performance electronics continues to be increasingly critical to the industry to satisfy the increasing market demand for more reliable, faster, smaller, lighter and more cost effective products. Near-junction cooling solutions are receiving increased attention as they provide performance enhancement while adding to the system energy efficiency and materials cost savings. This Webinar will review the current state-of-the-art thermal management solutions, as well as drivers for emerging technologies. About the Presenter: MICHAEL M. OHADI is a professor of mechanical engineering at the University of Maryland, College Park. His research expertise is heat/mass transfer enhancement and advanced thermal management solutions. He has conducted a diverse range of research projects for both industry and government agencies and has published extensively in his fields of expertise. He is a faculty member of CALCE and teaches the graduate level course in Thermal Issues in Electronics. He is a fellow member of both ASME and ASHRAE and has won numerous awards from both societies.
